KYE HTOL Board 1

适合系统Burn-in System: KYE-680
板尺寸Board Dimension : 570mm X 450mm
板端金手指规格 Board edge Finger: 86/43/100 ; 100/50/100
板层数Board layer:8 layer
芯片封装Package: BGA825
芯片间距Pitch:0.5